Description
The solder paste is manufactured using imported solder powder and high-efficiency active agent, Rosin is sourced locally from India. Slow release of solder paste happens in the reflow oven. Tin is melted uniformly and continuously to get a good soldering. Suitable for various type of PCB which include pads of tin Spray, Nickel, Gold, Silver, Organic Solderability Preservative (OSP). Less residue with no corrosion bright solder joints with high Surface Insulation resistance (SIR) are obtained.
FEATURES
- Excellent printing at high speeds, good adhesion.
- Excellent wettability, Wide Soldering process window.
- Stable process and reliable product with Bright colour of joints with, reliable solders
- Reflow operation in room air and Nitrogen.
- Various reflow soldering methods can be used.
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